The new SICK W2S family delivers powerful sub-miniature photoelectric positioning sensing for today’s most difficult packaging materials – even matt black. The slim housing allows convenient mounting within tight spaces demanded by compact machinery. The sensor’s cutting-edge photoelectric sensing promises production efficiency and reliability even with challenging objects to detect in packaging applications. “The new W2S performance enables high speed conveying lines to deliver efficiency even with matt black materials,” says Phil Dyas SICK (UK) industrial sensor specialist. “The SICK W2S gives manufacturers the opportunity to integrate modern photoelectric sensing power where it was difficult and expensive before.
