VOID Technologies, a developer of thermoplastics cavitation additive and masterbatch technologies, has appointed Mike Dennis as its new CEO.
The firm described Mike as a highly experienced C-suite leader with a strong track record in private equity-backed growth businesses. He brings commercial, strategic, and technical expertise to the role, having held senior positions at Garlock Printing and Converting, Interflex Group, and Alcan. He also has experience in VOID’s core markets of packaging and material sciences.
An engineer by training, Mike holds an M.S. in packaging engineering from Michigan State University. He will be based at VOID’s US headquarters in Neenah, Wisconsin.
David Traynor, executive chairman of VOID Technologies, said, “Mike is an excellent fit for VOID, joining us at a pivotal time as we move into commercial growth. The team is looking forward to working with Mike at this critical point in our development.”
Mike Dennis added, “This is an exciting time to be joining VOID. The technology is highly differentiated, the team is talented and motivated, and the commercial momentum is building. I look forward to working with our partners and customers to scale the business and deliver real impact.”
Mike succeeds James Gibson, VOID’s founding CEO, who will step down from the board and leave the business at the end of this year. James has led VOID since its formation in 2015 and remains a significant shareholder.
