BOSCH Packaging Technology has revealed details of a ‘high-tech’ packaging system it installed for Tunnock’s iconic Caramel Wafer biscuits.
Sir Boyd Tunnock, the chairman and CEO of the famous Uddingston-based family business has relied on Bosch equipment for 50 years – and approached the firm when he needed a new line to meet growing demand for his company’s products.
A two leg packaging system with intelligent infeed solution was implemented. Tunnock’s required to increase production output and decided to invest in an additional production line, which included a packaging line and a service package from Bosch.
Bosch said the aim was to increase output and flexibility on a smaller footprint compared to the existing lines. In addition, the new line had to be ‘easy to operate, clean and maintain for fast changeovers’.
Bosch provided a system which included a buffer, two horizontal flow wrappers with intelligent infeed and a flexible case packer.
“As quality and reliability are of highest importance to me, I always buy the best equipment. I am happy with my Bosch packaging lines, and that’s why I asked them to suggest a solution for our new caramel wafer line,” explained Sir Boyd Tunnock.
Bosch explained that once the rows of caramel wafer biscuits leave the enrober and pass through the cooling tunnel they reach the Sigpack DFR buffer, which accumulates products during short downstream stoppages. “The Sigpack DFR works on a first-in-first-out principle and discharges the products on demand to both of the two downstream wrapping legs,” the firm stated. “Each wrapping leg consists of a metal detector, a diefold machine and a Sigpack HCM multipack flow-wrapping machine with Sigpack FIT intelligent infeed.”
The two compact feeding modules use the linear motor technology instead of a traditional infeed with chains. This is said to provide a ‘fast and continuous’ product flow within the Sigpack HCM. The carriers automatically move and group the biscuits into multipacks of either four, five, six or eight. Bosch added that the film is folded and ‘longitudinally and transversely sealed’.
The multipacks are then transported in two streams from the two Sigpack HCM flow-wrappers into one Sigpack TTMC case packer.
Bosch said that due to the ‘compact design’ of the new intelligent infeed, the overall footprint of the packaging line could be reduced by four meters compared to the existing lines.
“The new Bosch packaging line is very compact. It saves us valuable floor space and achieves excellent efficiency results at maximum flexibility,” said Stuart Loudon, project manager at Tunnock’s.
Bosch said production levels on the new line ‘repeatedly exceed’ those achieved on the existing lines. “With the new line having the intelligent infeed system we expect to generate a fast return on investment based on increased efficiency, quicker changeover times and reduced maintenance costs,” said Bill Gow, financial director at Tunnock’s.
